Hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Medium hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Soft, low-profile foam polishing pad suitable for eccentric / DA machines together with Ditec Finec Cut. Size for Rupes 15 (125mm backing plate).
Extra Soft, low-profile foam polishing pad suitable for eccentric /DA machines together with Ditec Hologram remover. Size for Rupes 15 (125mm).
Hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Medium hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Soft, low-profile foam polishing pad suitable for eccentric / DA machines together with Ditec Finec Cut. Size for Rupes 21 (150mm backing plate)
Extra Soft, low-profile foam polishing pad suitable for eccentric /DA machines together with Ditec Hologram remover. Size for Rupes 21 (150mm).
Thin soft polishing pad for use with rotating machines and DItec Fine Cut or Hologram remover.
Medium polishing pad suitable for rotating machines together with Ditec Medium Cut.
Hard polishing pad suitable for rotating machines together with Ditec Heavy Cut.