Hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Medium hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Soft, low-profile foam polishing pad suitable for eccentric / DA machines together with Ditec Finec Cut. Size for Rupes 15 (125mm backing plate).
Extra Soft, low-profile foam polishing pad suitable for eccentric /DA machines together with Ditec Hologram remover. Size for Rupes 15 (125mm).
Hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Medium hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Soft, low-profile foam polishing pad suitable for eccentric / DA machines together with Ditec Finec Cut. Size for Rupes 21 (150mm backing plate)
Extra Soft, low-profile foam polishing pad suitable for eccentric /DA machines together with Ditec Hologram remover. Size for Rupes 21 (150mm).
Hard polishing pad suitable for eccentric / DA machines. This size is recomended for 75mm backing plate (Rupes Mini LHR75).
Extra soft polishing pad suitable for eccentric / DA machines. This size is recomended for 75mm backing plate (Rupes Mini LHR75).
Extra soft polishing pad suitable for oscillating machines. This size is recomended for 125mm backing plate (Rupes 15). 1 Box = 20 Pcs.