Woolpad for rotating and DA polishing machines. Size suitable for 75mm backing plate.
Woolpad for rotating and DA polishing machines. Size suitable for 50mm backing plate (Rupes Ibrid Nano).
New Size! High cutting power with very low levels of hologram! A smart choice when in need of high levels of cutting power, with good control of the heat build-up. This is a pad that is also very low on producing holograms, even on rotary machines. Especially useful on temperature sensitive paints or areas. Made mainly for rotary machines, but can also be used with DA. In situations like correcting painted plastic / curved areas or edges the lenght of the treads give less friction which in the end means a slower heat build-up giving the technican more margins for error etc. Proven powerful and efficient on both paint and gelcoat! We recommend it to be used with Ditec Heavy Cut & Ditec Medium Cut.
Size suitable for 75mm backing plate.
Size suitable for 50mm backing plate (Rupes Ibrid Nano)
Size suitable for 30mm backing plate (Rupes Ibrid Nano).
Versatile microfiber pad suitable for eccentric / DA machines. This size is recomended for 30-35mm backing plates (Rupes Ibrid Nano).
Versatile microfiber pad suitable for eccentric / DA machines. This size is recomended for 50mm backing plate (Rupes Ibrid Nano).
Hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Medium hard, low-profile polishing pad suitable for eccentric / DA machines together with Ditec Heavy Cut or Ditec Medium Cut.
Soft, low-profile foam polishing pad suitable for eccentric / DA machines together with Ditec Finec Cut. Size for Rupes 15 (125mm backing plate).
Extra Soft, low-profile foam polishing pad suitable for eccentric /DA machines together with Ditec Hologram remover. Size for Rupes 15 (125mm).